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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Materials Processing and Kinetic Phenomena: From Thin Films and Micro/Nano Systems to Advanced Manufacturing
Presentation Title Thin Film NiCr-, TiCr- & CuNi-based Cermets for Low-temperature Ultra-low Magnetoresistance Thermometers
Author(s) Joyce Palmer-Fortune, Nathanael Fortune, Neha Kondedan, Andreas Rydh
On-Site Speaker (Planned) Joyce Palmer-Fortune
Abstract Scope Measurements in high magnetic fields (heat capacity, thermal conductivity, thermopower, magnetocaloric, thermal Hall effect) require low mass thermometers sensitive over a wide temperature range with rapid thermal response and minimal, easily correctable magnetoresistance. We developed a new granular-metal oxide cermet for this purpose by co-sputtering NiCr and SiO2. We found that co-sputtered NiCr-SiO2 in mixed Ar:O2 working gas can produce resistive thin film thermometers sensitive enough to be used from room temperature to below 100mK in magnetic fields up to at least 35 tesla. Recently we have grown and characterized similarly grown CuNi- and TiCr-based cermet films. CuNi-SiO2 thin film cermets generally require more oxygen in the working gas compared to NiCr-SiO2 and TiCr-SiO2, yielding thermometers that are much less sensitive compared to similar NiCr-Based thermometers. Initial results show TiCr-based cermet thin film thermometers are much more like the NiCr-based cermet thin film thermometers.
Proceedings Inclusion? Planned:
Keywords Composites, Thin Films and Interfaces, Characterization

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Journey into Thin Metal Films - From Texture to Dewetting from Ultrathin Films to Nanophotonics
A Multitude of Fast Material Transport Paths in Solid State Dewetting of Thin Films
Adventures in the World of Nanocarbons: From CNf Mats to SACs on CNFs for Exceptional Electrochemical Water Splitting
Ambient-controlled Solid-State Dewetting of Copper and Nickel Thin Films
Application of Copper Nanoparticles in Microelectronics Packaging and Beyond
Atomic Kinetics in Highly Metastable Metallic Systems
Coarse-grained Molecular Modeling of Macropore-infused Nanocomposite Emulsion Thermosets (MINET)
Combinatorial Approach to Develop Sputter-deposited High-entropy Alloy Films for Inertial Confinement Fusion Applications
Control of Quasi-periodic Lengthscales and Morphologies in Eutectic Thin Films via Directional Laser Solidification
Cu and Cu-M Binary Alloys for Selective and Efficient Electrochemical CO2 Reduction Reaction
Deformation-based Additive Manufacturing as A Scalable Non-equilibrium Processing Tool
Design of Alloys with Solid-state Phase Evolutions that Accelerate Sintering and 3D Printing
Determination of the Friction Stir Welding Window from the Solid-state-bonding Mechanics under Severe Thermomechanical Conditions
Dislocation Formation in the Heteroepitaxial Growth of PbSe/PbTe Systems
Electrical Resistivity in Nanoscale Metals: Role of Surfaces and Grain Boundaries
Fabrication of Periodic Textures at Micron Label on Silicone Membrane Using Femtosecond Laser
Grain Growth by Defect Engineering: From Thin Films to Bulk Metal Alloys
Grain Growth Redux: beyond Smith, von Neumann, and Mullins
In Situ Laser Study and Fe-Cr-Ni Thin Film System
Kinetic Limitations in the Aluminum-lithium Electrochemical System for Lithium-ion Batteries
Microstructure by Design: Thin Film Grain Growth Experiments, Simulations, Data Analytics
Nano-Metallurgy for Renewable Energy Conversion
Nanoscale Morphology Control Using Ion Beams with Applications in Materials and Life Sciences
Relating Residual Stress Evolution to the Processes of Thin Film Growth
Simulated Surface Diffusion in Nanoporous Gold and Its Dependence on Surface Curvature
Sintering Kinetics of Compacted Core-shell Nickel-chromium Powder
The Interface between a Body-centered Cubic Crystal and Its Melt
The Microstructure Evolution of the Electroplating Cu Foil by the Multiple Switched Current Density Method
Thin Film NiCr-, TiCr- & CuNi-based Cermets for Low-temperature Ultra-low Magnetoresistance Thermometers
Thin Film Research to Market Application: A Story of Fundamental Innovation
Ultrastrong and Tough Stainless Steel Fabricated with Novel Additive Manufacturing Method

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