About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Materials Processing and Kinetic Phenomena: From Thin Films and Micro/Nano Systems to Advanced Manufacturing
|
Presentation Title |
Application of Copper Nanoparticles in Microelectronics Packaging and Beyond |
Author(s) |
Chee Lip Gan |
On-Site Speaker (Planned) |
Chee Lip Gan |
Abstract Scope |
Although lead-free tin-based solders is the dominant material currently used in microelectronics packaging, gold-based solders or silver nanoparticles pastes are also used in applications where high thermal conductivity between joints are required. In this study, we evaluate the application of copper nanoparticles paste as a die attach material. The copper nanoparticles have a size less than 20 nm which allows low temperature fusion, an organic passivation layer which prevents spontaneous particle fusion and growth at ambient temperatures, as well as avoiding oxidation before its usage. We studied the mechanical strength of chips bonded with the copper nanoparticles paste, and they demonstrate good reliability after thermal aging tests. We then applied the paste to bond commercial high power LED chips to ceramic substrate, which gives better electrical and optical properties than Au-Sn solders while maintaining the mechanical strength of the joint. |
Proceedings Inclusion? |
Planned: |
Keywords |
Copper / Nickel / Cobalt, Electronic Materials, Joining |