About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
|
Materials Processing and Kinetic Phenomena: From Thin Films and Micro/Nano Systems to Advanced Manufacturing
|
Presentation Title |
The Microstructure Evolution of the Electroplating Cu Foil by the Multiple Switched Current Density Method |
Author(s) |
Yun-Fong Lee |
On-Site Speaker (Planned) |
Yun-Fong Lee |
Abstract Scope |
Electroplating processes can induce the accumulation of internal stress within the foil, and higher current densities tend to amplify this effect. To mitigate stress accumulation, we propose the multiple switched current density (MSCD) method to switch current density from high to low. This method works in the room temperature without heating. We not only observed some specific phenomenon of the microstructure in MSCD process, such as internal stress releases during the MSCD process, larger grain size obtained in MSCD process, but also found detwinning in the twin boundaries within the grains. Furthermore, the elongation of Cu foil promotes dramatically from 6.33% to 22.07%, and the tensile strength also slightly increases. Besides, we illustrate the evolution of the microstructure, and expound the mechanism during the MSCD method. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Process Technology, Other |