About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
|
Materials Processing and Kinetic Phenomena: From Thin Films and Micro/Nano Systems to Advanced Manufacturing
|
Presentation Title |
Electrical Resistivity in Nanoscale Metals: Role of Surfaces and Grain Boundaries |
Author(s) |
Kevin Coffey |
On-Site Speaker (Planned) |
Kevin Coffey |
Abstract Scope |
The electrical resistivity of nanoscale metals is crucial to semiconductor interconnect signal propagation speed and power consumption. The increased resistivity due to electron scattering from surfaces and grain boundaries is described by the semi-classical Fuchs-Sondheimer and Mayadas Shatzkes models for surface and grain boundary scattering, respectively. This presentation will review a quantitative comparison of these two phenomena for copper, and a further application to single crystal conductors of tungsten and ruthenium. The presentation will include a description of the processing needed to prepare the experimental samples. For polycrystalline copper, the dominant role of grain boundary scattering is observed. For single crystal tungsten nanowires, a crystalline anisotropy of surface scattering is observed and attributed to the anisotropy of the tungsten Fermi surface. Finally, for single crystal films of ruthenium, it is shown that nearly specular surface scattering is achievable and, further, that it is reversible with oxidizing and reducing annealing treatments. |
Proceedings Inclusion? |
Planned: |
Keywords |
Thin Films and Interfaces, Nanotechnology, Electronic Materials |