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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Materials Processing and Kinetic Phenomena: From Thin Films and Micro/Nano Systems to Advanced Manufacturing
Presentation Title Combinatorial Approach to Develop Sputter-deposited High-entropy Alloy Films for Inertial Confinement Fusion Applications
Author(s) Eunjeong Kim, Alison M. Engwall, Gregory Vincent Taylor, Swanee J. Shin, Alexander A. Baker, James Barrett Merlo, Liam Robert Sohngen, David J. Strozzi, Brandon Joseph Bocklund, Emily Elaine Moore, Scott Michael Peters, Aurelien Pierre Philippe Perron, Sergei O. Kucheyev, Leonardus Bimo Bayu Aji
On-Site Speaker (Planned) Eunjeong Kim
Abstract Scope After the breakthrough demonstration of inertial confinement fusion (ICF) ignition in December 2022, the next goal is to increase the fusion energy yield to tens of megajoules. To achieve this goal, a new generation of hohlraums may be required. Hohlraums are centimeter-scale sphero-cylindrical cans made from heavy metals with a thickness of >10 µm. Hohlraums are typically fabricated by magnetron sputtering. They must balance design constraints, including x-ray conversion efficiency, mechanical and corrosion stability, and electrical resistivity. Here, we present results of our systematic study by combinatorial magnetron co-sputtering, aimed at developing a family of Au-Ta-W-Pt, Au-Ta-W-Bi, Au-Ta-Pt-Bi, Au-W-Pt-Bi, and Ta-W-Pt-Bi films. Effects of the alloy composition and deposition process parameters on the microstructure, residual stress, mechanical properties, and electrical transport will be considered, as well as implications for ICF applications. This work was performed under the auspices of the U.S. DOE by LLNL under Contract DE-AC52-07NA27344.
Proceedings Inclusion? Planned:
Keywords High-Entropy Alloys, Characterization,

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Journey into Thin Metal Films - From Texture to Dewetting from Ultrathin Films to Nanophotonics
A Multitude of Fast Material Transport Paths in Solid State Dewetting of Thin Films
Adventures in the World of Nanocarbons: From CNf Mats to SACs on CNFs for Exceptional Electrochemical Water Splitting
Ambient-controlled Solid-State Dewetting of Copper and Nickel Thin Films
Application of Copper Nanoparticles in Microelectronics Packaging and Beyond
Atomic Kinetics in Highly Metastable Metallic Systems
Coarse-grained Molecular Modeling of Macropore-infused Nanocomposite Emulsion Thermosets (MINET)
Combinatorial Approach to Develop Sputter-deposited High-entropy Alloy Films for Inertial Confinement Fusion Applications
Control of Quasi-periodic Lengthscales and Morphologies in Eutectic Thin Films via Directional Laser Solidification
Cu and Cu-M Binary Alloys for Selective and Efficient Electrochemical CO2 Reduction Reaction
Deformation-based Additive Manufacturing as A Scalable Non-equilibrium Processing Tool
Design of Alloys with Solid-state Phase Evolutions that Accelerate Sintering and 3D Printing
Determination of the Friction Stir Welding Window from the Solid-state-bonding Mechanics under Severe Thermomechanical Conditions
Dislocation Formation in the Heteroepitaxial Growth of PbSe/PbTe Systems
Electrical Resistivity in Nanoscale Metals: Role of Surfaces and Grain Boundaries
Fabrication of Periodic Textures at Micron Label on Silicone Membrane Using Femtosecond Laser
Grain Growth by Defect Engineering: From Thin Films to Bulk Metal Alloys
Grain Growth Redux: beyond Smith, von Neumann, and Mullins
In Situ Laser Study and Fe-Cr-Ni Thin Film System
Kinetic Limitations in the Aluminum-lithium Electrochemical System for Lithium-ion Batteries
Microstructure by Design: Thin Film Grain Growth Experiments, Simulations, Data Analytics
Nano-Metallurgy for Renewable Energy Conversion
Nanoscale Morphology Control Using Ion Beams with Applications in Materials and Life Sciences
Relating Residual Stress Evolution to the Processes of Thin Film Growth
Simulated Surface Diffusion in Nanoporous Gold and Its Dependence on Surface Curvature
Sintering Kinetics of Compacted Core-shell Nickel-chromium Powder
The Interface between a Body-centered Cubic Crystal and Its Melt
The Microstructure Evolution of the Electroplating Cu Foil by the Multiple Switched Current Density Method
Thin Film NiCr-, TiCr- & CuNi-based Cermets for Low-temperature Ultra-low Magnetoresistance Thermometers
Thin Film Research to Market Application: A Story of Fundamental Innovation
Ultrastrong and Tough Stainless Steel Fabricated with Novel Additive Manufacturing Method

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