| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
Additive Manufacturing Internal Strain Gauges via Electroless Plating |
| Author(s) |
Timothy B. Phillips, Jared Allison, Joseph Beaman |
| On-Site Speaker (Planned) |
Timothy B. Phillips |
| Abstract Scope |
Additive manufacturing (AM) is a rapidly growing field that enables production of complex geometries without tooling. AM has gained traction as a method of producing complex circuits not possible using traditional techniques. The popular approaches for AM of circuits, such as embedding wires or applying conductive inks, are limited to simple geometries or sub-par electrical conductivity. Electroless plating is a promising alternative approach that uses pure copper as the conductive trace. Previously, surface plating has been accomplished on fused deposition modeling parts but is limited in complexity and component density. This manuscript presents a novel approach by creating channels within a part and subsequently plating them to create complex, 3D traces. A strain gauge with an internal helix trace and tunable stiffness is introduced and characterized as an example. This approach can be extended to embed electrical components within the channels during the build process to create high-density electronics. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |