| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
Toward High-quality Metal Binder Jetting Additive Manufacturing using Low-cost Powder |
| Author(s) |
Kijoon Lee, Chinedum Okwudire, Chen Qian |
| On-Site Speaker (Planned) |
Kijoon Lee |
| Abstract Scope |
Metal binder jetting (MBJ) is rapidly expanding, driven by its high scalability and relatively low manufacturing cost. However, high powder costs remain a barrier to adopting MBJ in industry. Considering low-cost water-atomized powder (WAP) as an alternative to expensive gas-atomized powder (GAP) can result in significant powder cost savings. In this study, we investigate the potential of using powder surface topography and ultrasonic signals as indicators for powder bed density in MBJ, with the aim of using the measurements for closed-loop control. Utilizing a custom-built binder jetting machine tool, we examine powder beds composed of GAP, WAP, and a mix of WAP with small amounts of GAP. A laser profilometer and ultrasonic sensor are employed to detect voids on the external surface and within the layer, respectively. The collected sensing data is analyzed and compared with the measured powder bed packing density, ultimately establishing a correlation between the two. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |