|About this Abstract
|2023 TMS Annual Meeting & Exhibition
|Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
|Study of Interfacial Stability for Medium-temperature GeTe-based Thermoelectric Modules
|Cheng-Hao Kung, Albert T. Wu
|On-Site Speaker (Planned)
GeTe has been considered as one of the potential medium-temperature thermoelectric materials because of its small band gap, excellent zT value and Pb-free. Assembly a thermoelectric module requires joining the GeTe with metallic electrodes, most probable to be Cu or Ni. Severe interaction would occur when the module is operated at temperatures higher than 200 oC. The instability of the interface would lead to failure of the joints. Furthermore, drastic atomic interdiffusion would lead to the formation of undesirable intermetallic compound. The formation of the compound that not only deteriorated the thermoelectric performance, it could drastically degrade the reliability of the modules. This study reports the morphological evolution along with materials characterization to discuss the kinetics of interfacial reaction. Selection of materials as a diffusion barrier to enhance the joint property is also discussed.
|Copper / Nickel / Cobalt, Electronic Materials, Thin Films and Interfaces