About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
|
Presentation Title |
Effect of Trace Bi on the Mechanical Strength of Sn Solder Before and After Thermal Aging |
Author(s) |
Yu-An Shen |
On-Site Speaker (Planned) |
Yu-An Shen |
Abstract Scope |
Sn is essential for solder joints. Due to its weak strength, elemental additions into Sn to form Sn-rich solder alloys are common for practical applications. Bi is one of the typical additional elements because of its good hardness. Although some studies have found the solid solution and precipitation of Bi significantly reinforce the Sn matrix, the strengthening mechanism of Bi has not been understood clearly, especially for the Sn matrix with trace Bi additions. In this study, Sn-rich alloys with Bi of 2.5 and 5 wt.% were fabricated to figure out the strengthening mechanism of Bi. The hardness tests evaluate the strengthening changes before and after the Bi additions. Moreover, the strengthening mechanism of Bi can be supported by the microstructural changes after thermal aging at 150°C for one week. X-ray diffraction and scanning electron microscope with EDS and BSE exhibit the microstructural changes. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Phase Transformations, Mechanical Properties |