|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage
||Hiroaki Tatsumi, Hiroshi Nishikawa
|On-Site Speaker (Planned)
High power density operation of electronics devices, such as power modules, causes heat density increase. Therefore, a highly thermal-conductive and high-temperature reliable joint is demanded in electronics packaging. This study proposes a novel anisotropic Cu-solder composite joint by using a unidirectional porous Cu sheet and Sn-Ag-Cu (SAC) solder. During a simple reflow process at 260 °C, the anisotropic composite joint was successfully fabricated through the molten solder penetration into the porous-Cu pores. Steady-state thermal conductivity measurement showed that the equivalent thermal conductivity of this joint was approximately 2.5 times higher than that of the SAC-soldered joint. Finite element simulation revealed the unidirectional Cu structure contributed to thermal conductivity enhancement. High temperature storage (HTS) test at 200 °C for 1008 h demonstrated its stable joint strength: 48.8 (0 h) and 46.3 MPa(1008 h). These results have proven that this novel anisotropic composite joint is promising for high-temperature electronics applications.
||Joining, Electronic Materials, Modeling and Simulation