About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
|
Presentation Title |
Two Phase Stability Affecting Electromigration Failure Mechanism of Solder Alloys |
Author(s) |
Choong-un Kim |
On-Site Speaker (Planned) |
Choong-un Kim |
Abstract Scope |
This paper presents experimental and theoretical evidences suggesting the importance of maintaining two-phase equilibrium in Sn-based solder alloys in enhancing stability of solder joint against electromigration induced failure mechanisms. Our study has been motivated by the lack of knowledge on the microstructural mechanism of solder joint failure by electromigration while it has emerged as one of major technical challenges against development of advanced device packaging. Many years of extensive efforts to enable advanced understanding, involving microstructural analysis of failed solder joints and the kinetic analysis of electromigration kinetics in diffusion couple, have led to the conclusion that the loss of two-phase field in the solder matrix is prelude of failure. It is our belief that the two-phase equilibrium enforced by the existence of Cu, Ni, and/or Ag bearing intermetallic compounds makes the Sn flux to be limited and thus delay the failure process. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Joining, Phase Transformations |