|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Electromigration-induced Abnormal IMC Volume Expansion in Micro Joints with Au/Pd(P)/Ni(P) Surface Finish
||Cheng-Yu Lee, Shun-Cheng Chang, Chih-Tsung Chen, Pei-Tzu Lee, Cheng-En Ho
|On-Site Speaker (Planned)
Electroless Ni/electroless Pd/immersion Au (ENEPIG) trilayer has become one of the most popular surface finishes treating over the Cu pads in high-end microelectronic components. The Au film serves as oxidation resistance. The underlying Ni(P) film functions as a diffusion barrier, preventing the Cu pads from solder during soldering or a subsequent normal lifetime use. The deposition of a Pd(P) layer between Au and Ni(P) can reduce the galvanic hyper-corrosion in the Ni(P) film resulting from the immersion Au process (black pads), and also act as an efficient diffusion barrier between Au and Ni(P), thereby advancing the solderability and bondability of metallization pads. Since the Au/Pd(P)/Ni(P) trilayer is now being attempted in the micro-joint applications, the electrical and mechanical reliabilities of smaller joints with ENEPIG should be reassessed at the present stage. We revealed an abnormal Pd-embrittlement phenomenon induced by electromigration, which might seriously deteriorate the electrical/mechanical reliabilities of micro joints.
||Other, Other, Other