|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Effect of Cu Addition on Mechanical Properties of In-Sn Alloy Before and After Isothermal Aging
||Hiroshi Nishikawa, Han Le Duy, Hiroaki Tatsumi
|On-Site Speaker (Planned)
The tin-indium eutectic (In-48Sn) alloy is a promising candidate for low-temperature applications especially for flexible electronic devices owing to its low melting-temperature (118 ℃), good wettability, and high ductility. However, In-48Sn alloy has a low mechanical strength and low creep resistance. In this study, we investigated the effect of Cu addition on microstructure and mechanical properties of In-Sn alloys before and after isothermal aging at 60 ℃. The results revealed that the microstructure of In-Sn-Cu alloy was clearly refined by Cu addition. The fine microstructure led to enhance tensile strength of In-Sn-Cu alloy compared to that of In-Sn alloy. Moreover, the two kinds of intermetallic compounds (IMCs) were formed in the In-Sn-Cu alloy, which also supported for the improvement of tensile strength of the alloy. Then, the Cu addition enhanced thermal stability of In-Sn alloy and In-Sn-Cu had better thermal stability than In-48Sn.