|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Solder Joint Properties of Nickel-less Surface Finishes - Direct Electroless Gold (DEG) and Electroless Palladium Immersion Gold (EPIG)
||So-Yeon Jun, Tae-Young Lee, Min-Su Kim, Deok-Gon Han, Tae-Ho Lee, Sehoon Yoo
|On-Site Speaker (Planned)
Recently, Ni-less surface finish, electroless palladium immersion gold (EPIG) and direct electroless gold (DEG) has been introduced to suppress the ferromagnetic Ni(P)-related impedance increase at high frequency. In this study, we investigated the interfacial reactions and mechanical properties of DEG and EPIG surface finishes with Sn-Ag-Cu(SAC) solder joints. The intermetallic compound (IMC) were Cu6Sn5 for DEG/SAC or EPIG/SAC samples while (Cu,Ni)6Sn5 and Ni3P for ENEPIG/SAC. After 1000 h of thermal aging, the IMC thickness of the DEG/SAC and EPIG/SAC samples increased by 217% and 181%, respectively, compared to ENEPIG/SAC, which increased by 51%. Although the ENEPIG had the lowest IMC thickness, its brittleness was higher than that of DEG and EPIG because of the different fracture path. Brittle fracture behavior and fracture surface was also evaluated for the DEG/SAC and EPIG/SAC solder joints and further results will be discussed.
||Other, Other, Other