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Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Designing Complex Microstructures through Additive Manufacturing
Presentation Title Interpenetrating microstructure in laser powder-bed fusion parts using selective rescanning
Author(s) Bharath Bhushan Ravichander, Golden Kumar
On-Site Speaker (Planned) Golden Kumar
Abstract Scope In-situ microstructural control is desirable in additively manufactured metal parts due to limited post-processing options for net-shaped components. Here, we introduce a novel selective rescanning approach to control the local solidification conditions and the microstructure in metal parts produced by laser powder-bed fusion (LPBF). We show that the melt pool dimensions, grain size, and sub-grain cell structure can be selectively varied in three dimensions to engineer the mechanical response of LPBF parts. The lattice-based rescan strategy enables the formation of an interpenetrating microstructure comprised of fine and coarse grains. The localized heating and cooling-induced thermal stresses increase the hardness and tensile strength of rescanned specimens. The study shows the potential of selective remelting strategy as a promising avenue for achieving precise control of microstructure and properties in as-printed LPBF parts without subsequent processing.
Proceedings Inclusion? Planned:
Keywords Additive Manufacturing, Mechanical Properties, Other

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Invar-Ag Microcomposites Formed by Ag Dendritic/Cellular Infiltration of pre-Cast or pre-Additively Manufactured Invar-Cu
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Laser powder bed fusion of CuCrZr - In625 multi-materials
Laser powder bed fusion of In718/GRCop-42 bimetallic structures: effect of deposition order and process parameters
Laser Powder Bed Fusion Processing of Oxide Dispersion-Strengthened (ODS) Pure Copper for High-Resolution and High-Strength Complex-Geometry 3D Components
Microstructural Control in Directed Energy Deposition: In-Situ Layer Thickness Control and Analytical Modeling with 316L Stainless Steel
Microstructural control of additively manufactured Ti-6Al-4V via in-situ laser annealing
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