About this Abstract |
Meeting |
2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Symposium
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2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Presentation Title |
Assessing Aerosol-jet Printed Gold Inks for Printed Electronics Applications |
Author(s) |
Yongkun Sui, Lok-kun Tsui, Chowdary R. Koripella, Andrew Sanford, Judith M. Lavin |
On-Site Speaker (Planned) |
Yongkun Sui |
Abstract Scope |
Aerosol-jet printing (AJP) capable of depositing high-resolution conductive, resistive, and dielectric films on various rigid and flexible substrates has demonstrated its potential for printed electronics applications. Here, we will assess commercial off-the-shelf gold nanoparticle inks for electrical interconnects using AJP. Firstly, printing quality in terms of line width, line height and overspray for three different inks from UTDots and NovaCentrix will be evaluated and optimized by tuning AJP operation parameters. Next, sintering of these inks will be optimized based on in-situ resistance measurement. Then, conductivities will be calculated based on 4-point probe sheet resistance measurement. Finally, adhesion of these ink printed on various rigid and flexible polymer substrates will be tested. The assessment of these inks and printing process optimization provide some insights to ink selection for printed gold interconnects.
SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |