About this Abstract |
Meeting |
2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Symposium
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2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Presentation Title |
NEW TIME (was 1:30 pm) Digital Image Correlation of Architected Materials: Challenges, Lessons Learned and Opportunities |
Author(s) |
Irving E. Ramirez-Chavez, Mandar Shinde, Jarom Hatch, Charles-Olivier Amyot, Dhruv Bhate |
On-Site Speaker (Planned) |
Irving E. Ramirez-Chavez |
Abstract Scope |
Digital Image Correlation (DIC) is a non-contact, optical technique for the measurement of full-field displacements and strains, most typically during a mechanical test. The benefit of DIC in the study of additively manufactured architected materials such as honeycombs, lattices, and sheet-based cellular structures, stems from the heterogeneous state of strain in these structures that is a result of their complex geometry and its interaction with applied loads. However, architected materials, with their small feature sizes and large deformation capabilities, present some challenges for DIC. These include sensitivity to speckle pattern, loss of data at large global strains, and handling of noise during post-processing. In this presentation, we discuss our efforts in applying DIC to the study of compression behavior in several studies spanning honeycombs and sheet-based architected materials, with single and dual-phases. This forms the basis for a discussion of lessons learned, and for identifying opportunities for further study. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |