About this Abstract |
Meeting |
2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Symposium
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2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Presentation Title |
Design and Additive Manufacturing of Bio-inspired Copper Heat Sinks for Microelectronics Cooling |
Author(s) |
Jordan Yaple, Cameron Noe, Abdulmajeed Alenezi, Patrick Phelan, Dhruv Bhate |
On-Site Speaker (Planned) |
Jordan Yaple |
Abstract Scope |
The heat sink is a key component in thermal management of microelectronics and is traditionally designed with arrays of pins or fins. In this work, a bio-inspired approach to designing heat sinks was evaluated. A process was first developed on a 100W Laser Powder Bed Fusion (LPBF) system for the copper alloy CuNi2SiCr, which was found to have a tenfold reduction in thermal conductivity relative to commercially pure Copper. This process was then used to fabricate four heat sinks: two of these replicates of commercial heat sink designs, and two leveraging bio-inspired design approaches with the aim of increasing the available surface area per unit volume. The four designs were tested on a microelectronics package placed on a hot plate and their performance compared against commercially available heat sinks. The results demonstrated that despite their poor thermal conductivity, the bio-inspired heat sinks had equivalent performance to the commercial heat sinks. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |