About this Abstract |
Meeting |
2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Symposium
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2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
|
Presentation Title |
INSERTING COMPONENTS INTO GEOMETRIES CONSTRUCTED ONTO A NON-STANDARD SUBSTRATE FOR ELECTRONICS PACKAGING |
Author(s) |
Robert Plant |
On-Site Speaker (Planned) |
Robert Plant |
Abstract Scope |
AM processes must be optimised to meet standard requirements for industrial applications. Here, we investigate constructing geometries onto non-standard substrates using stereolithography (SLA), for the end use of electronics packaging. Compared to conventional processes, SLA permits greater flexibility to arrange components in three dimensions. This enables an increased feature density, optimised packages for contorted or confined spaces, and permits rapid production for bespoke applications.
The SLA process-material effects and substrate interactions can compromise the ability to deliver products to the required standard. The specific phenomena of interest to this application, is the quality of adhesion. This has been substantially enhanced by a technique involving plasma treatment and the application of a monolayer. The compliance of the product with relevant standards is also reviewed. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |