About this Abstract |
Meeting |
2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Symposium
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2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
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Presentation Title |
Understand Powder Deposition Behaviors of a Novel Electrostatic Powder Spreading Technique using Molecular Dynamics Simulation |
Author(s) |
Ziheng Wu, Michael Troksa, Gabe Guss, Joshua R DeOtte, Brian Giera, Eric Elton |
On-Site Speaker (Planned) |
Ziheng Wu |
Abstract Scope |
Powder bed fusion is gaining more industrial presence across many sectors due to its increasing productivity. Most of the current process improvements focus on beam optimization while limited attention has been paid to modifying the spreading technique. Many industries show interest in multi-material printing as their applications can leverage the beneficial properties from several materials. However, almost all the existing spreading techniques are mechanical based which prevents the deposition of different feedstocks selectively. We are developing a contact free electrostatic powder spreader which can perform multi-material powder patterning and in-situ mixing. This study focuses on the development of a powder dynamics simulation which has been validated against deposition rate experiments using the electrostatic spreader. The model is used to study the different powder responses at various spreader geometries, electric fields, and materials. The results provide us important insights and guidelines for spreader prototyping.
*Prepared by LLNL under Contract DE-AC52-07NA27344. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |