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About this Symposium
Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Yu-Chen Liu, National Cheng Kung University
Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Yee-wen Yen, National Taiwan University of Science and Technology
Chih-Ming Chen, National Chung Hsing University
Chao-hong Wang, National Chung Chung University
Jaeho Lee, Hongik University
Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology
Ming-Tzer Lin, National Chung Hsing University
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ligang Zhang, Central South University
Sehoon Yoo, Korea Institute of Industrial Technology
Ping-Chuan Wang, SUNY New Paltz
Yu-An Shen, Feng Chia University
Scope This is the 24th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/15/2024
Proceedings Plan Planned:
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

Advanced characterization and analysis for improved stable material structures
Advanced Materials for Optimized and phase change based Sustainable Thermal Management Solutions
Bonding mechanism for Cu/SiO2 hybrid joints
Computational simulation of interfacial bonding behavior with various grain structures in Cu-Cu bonding
Effect of Copper Grain Size on Interfacial Reactions of Copper/Solder/Copper sandwiched joints
Effect of Interfacial Microstructure on Mechanical and Electrical Properties in Ultrasonically-Welded Ni/Al/Ni Lamellar Structure
Elastin-like recombinamer-mediated hierarchical mineralization coatings on Zr-16Nb-xTi (x = 4,16 wt%) alloy surfaces improve biocompatibility
Electrochemical Evaluation of Plating Parameters in Anomalous Codeposition Behavior of Invar Electroplating
Electrodeposited gallium for Cu-to-Cu interconnection
Exploring Low-Temperature Soldering with Good Soldering Strength: Investigating Soldering Behavior
Exploring solder wetting angle by using machine learning approach
Fabrication and properties of nanotwinned copper doped with carbon nanotubes by electrodeposition
Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly
Growth of Cu6Sn5 in a Cu/Sn/Cu micro-joint with a TFMG/Cu dual diffusion barrier layer during thermocompression bonding
High-strength and High-conductivity Nanotwinned Copper Foils via Cu-Ni Co-Electrodeposition
In-situ Characterization of Electrical Current Induced Structural Changes in Single-Phase η-Cu6Sn5 Using Synchrotron Radiation
Interfacial reactions between Sn-based solders and FeCoNiCrMn high-entropy alloy
Joint Properties of Ni-less Surface Finish / Sn-Alloy Solder Using Laser-Assisted Bonding (LAB) Technique
Li and Na interaction in intercalation materials
Liquid-solid interfacial Reactions between lead-free Solders and Cu-6.01wt.% Sn-0.12wt.%P alloy (C5191)
Liquidus and invariant reaction temperatures of Sn-In-Ni-Zn alloys
Liquidus projection and invariant reactions of Bi-Cu-Sn system
Liquidus projections and invariant reactions in the Bi-Cu-Sn-Te quaternary system
Liquid/Solid Interfacial Reactions between the Sn Solder and Cu-Fe Alloy (C194) with the Ni Plating Layer
Microstructure evolution and growth behavior of intermetallic compound between Cu and Sn-Ag alloys
Microstructure Evolution and Phase Transformation of Ni-Sn Compounds after Long-Term Storage
Microstructures of Ag-In transient liquid phase bonding using In-coated Ag sheet
Orientation Effects on the Electrically Induced Phase Transformation in Zirconia
Phase equilibria, solidification and properties of Al-Cu-Ni-Sn alloys
Simulation of polycrystalline microstructure formation in thin film for nanoscale device using phase-field method
Sn-Zn-Bi Low-Melting Alloy with Great Aging Resistance and Wettability
Solid Solution of Multiple Components in Bismuth Rhombohedral Phase
Solid/Solid Interfacial Reactions between Lead-free Solders and Cu-Ni-Si-Mg (C7025) Substrate
Striped Strain-Induced Coherency Loss Leading to Metastable Nanoprecipitate Phase Transformation in Al-Zn-Mg Alloys
Synergistic inhibition effect of nitrides and metal ions on corrosion of copper
The effect of temperature on the microstructure, lattice, mechanical and electrical properties of Sn-Bi alloys
Tuning topotactic transformations in vanadium oxide thin films for microbolometer applications


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