ProgramMaster Logo
Conference Tools for 2025 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
Presentation Title The effect of temperature on the microstructure, lattice, mechanical and electrical properties of Sn-Bi alloys
Author(s) Xin Fu Tan, Stuart D McDonald, Keith Sweatman, Kazuhiro Nogita
On-Site Speaker (Planned) Xin Fu Tan
Abstract Scope Sn-Bi low temperature solders have attracted interest because of their low liquidus temperature, low costs and non-toxicity. While the solubility of Sn in Bi is relatively low, the solubility of Bi in Sn can range from approximately 3 w% at room temperature to 21 wt% at the eutectic temperature at 139°C. This results in the dissolution and precipitation of Bi into and out of Sn as the temperature varies, causing significant changes to the microstructure, lattice, and mechanical and electrical properties of the Sn-Bi solders. This talk discusses the temperature-dependent microstructure, crystal structure, and mechanical and electrical property changes of Sn-Bi solder alloys, characterised by various temperature controlled in-situ testing methods. These methods include scanning electron microscopy (SEM), synchrotron powder X-ray diffraction (PXRD), tensile testing and four-point electrical resistance measurements. The work highlights the non-linear changes in lattice parameters, mechanical properties and electrical resistivity with respect to temperature.
Proceedings Inclusion? Planned:
Keywords Characterization, Mechanical Properties,

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Advanced characterization and analysis for improved stable material structures
Advanced Materials for Optimized and phase change based Sustainable Thermal Management Solutions
Bonding mechanism for Cu/SiO2 hybrid joints
Computational simulation of interfacial bonding behavior with various grain structures in Cu-Cu bonding
Effect of Copper Grain Size on Interfacial Reactions of Copper/Solder/Copper sandwiched joints
Effect of Interfacial Microstructure on Mechanical and Electrical Properties in Ultrasonically-Welded Ni/Al/Ni Lamellar Structure
Elastin-like recombinamer-mediated hierarchical mineralization coatings on Zr-16Nb-xTi (x = 4,16 wt%) alloy surfaces improve biocompatibility
Electrochemical Evaluation of Plating Parameters in Anomalous Codeposition Behavior of Invar Electroplating
Electrodeposited gallium for Cu-to-Cu interconnection
Exploring Low-Temperature Soldering with Good Soldering Strength: Investigating Soldering Behavior
Exploring solder wetting angle by using machine learning approach
Fabrication and properties of nanotwinned copper doped with carbon nanotubes by electrodeposition
Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly
Growth of Cu6Sn5 in a Cu/Sn/Cu micro-joint with a TFMG/Cu dual diffusion barrier layer during thermocompression bonding
High-strength and High-conductivity Nanotwinned Copper Foils via Cu-Ni Co-Electrodeposition
In-situ Characterization of Electrical Current Induced Structural Changes in Single-Phase η-Cu6Sn5 Using Synchrotron Radiation
Interfacial reactions between Sn-based solders and FeCoNiCrMn high-entropy alloy
Joint Properties of Ni-less Surface Finish / Sn-Alloy Solder Using Laser-Assisted Bonding (LAB) Technique
Li and Na interaction in intercalation materials
Liquid-solid interfacial Reactions between lead-free Solders and Cu-6.01wt.% Sn-0.12wt.%P alloy (C5191)
Liquidus and invariant reaction temperatures of Sn-In-Ni-Zn alloys
Liquidus projection and invariant reactions of Bi-Cu-Sn system
Liquidus projections and invariant reactions in the Bi-Cu-Sn-Te quaternary system
Liquid/Solid Interfacial Reactions between the Sn Solder and Cu-Fe Alloy (C194) with the Ni Plating Layer
Microstructural analysis and mechanical properties evaluation of zinc-coated aluminum particles
Microstructure evolution and growth behavior of intermetallic compound between Cu and Sn-Ag alloys
Microstructure Evolution and Phase Transformation of Ni-Sn Compounds after Long-Term Storage
Orientation Effects on the Electrically Induced Phase Transformation in Zirconia
Phase equilibria, solidification and properties of Al-Cu-Ni-Sn alloys
Simulation of polycrystalline microstructure formation in thin film for nanoscale device using phase-field method
Sn-Zn-Bi Low-Melting Alloy with Great Aging Resistance and Wettability
Solid Solution of Multiple Components in Bismuth Rhombohedral Phase
Solid/Solid Interfacial Reactions between Lead-free Solders and Cu-Ni-Si-Mg (C7025) Substrate
Striped Strain-Induced Coherency Loss Leading to Metastable Nanoprecipitate Phase Transformation in Al-Zn-Mg Alloys
Synergistic inhibition effect of nitrides and metal ions on corrosion of copper
The effect of temperature on the microstructure, lattice, mechanical and electrical properties of Sn-Bi alloys
Tuning topotactic transformations in vanadium oxide thin films for microbolometer applications

Questions about ProgramMaster? Contact programming@programmaster.org