| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Sn-Zn-Bi Low-Melting Alloy with Great Aging Resistance and Wettability |
| Author(s) |
Hao-Zhe Kao, Chih-Ming Liang, Yu-An Shen |
| On-Site Speaker (Planned) |
Yu-An Shen |
| Abstract Scope |
Advanced semiconductor packaging requires effective solutions, and utilizing low-melting, lead-free solders can significantly benefit the environment. Eutectic Sn-Zn alloys, with a melting point of 199°C, are lower than Sn-rich solders. However, the oxidation of Zn and the coarsening of Zn during aging can degrade the reliability of solder joints. This study addresses these issues by adding an appropriate amount of Bi to Sn-Zn alloy to lower the melting point, thereby reducing the soldering temperature while maintaining good wettability. Although Bi cannot prevent Zn coarsening during aging, it redistributes evenly within the alloy, allowing the aged Sn-Zn-Bi alloy to retain the strength of its as-cast state, thereby achieving effective aging resistance. More detailed analyses will be presented in the poster. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Mechanical Properties |