| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Solid Solution of Multiple Components in Bismuth Rhombohedral Phase |
| Author(s) |
Hsiu-Mei Yang, Tzu-hsuan Huang, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shih-kang Lin |
| Abstract Scope |
SnBi eutectic system is an attractive option for low temperature solder due to its low cost, good wettability, low melting temperature (138˚C), and environmentally friendliness. However, traditional Sn-Bi-based solder exhibits brittle in Bi-rich phase and coarsen its microstructure during thermal aging, leading to significant decay in mechanical properties and reliability. Recently, doping elements to suppress (Bi)-rich phase growth has been considered a promising way to improve the mechanical properties. In this talk, we will report Bi5Sn5Sb, Bi5Sn5Zn and Bi5Sn5Sb saturated solubility of the doping element in the bismuth phase equilibrium based on elemental analyses. In addition, the effect of different concentrations and orientations were elaborated in nanoindentation, which is a crucial study for the fundamental research on solder-based materials. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Phase Transformations, Solidification |