| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Effect of Interfacial Microstructure on Mechanical and Electrical Properties in Ultrasonically-Welded Ni/Al/Ni Lamellar Structure |
| Author(s) |
Jheyu Lin, Kuan-Chieh Hu |
| On-Site Speaker (Planned) |
Jheyu Lin |
| Abstract Scope |
This research examines the microstructure evolution and bonding performance of three-layered Ni/Al/Ni lamellar composites, which are ultrasonically welded for use in electric vehicle battery modules. This technique is an alternative to traditional fusion welding, which faces challenges with such material combinations. Regarding the joining process, a 2000 N clamping force and 800 J of welding energy achieved a bond strength of approximately 400 N. Detailed SEM and TEM analyses identified an 80 nm -thick NiAl intermetallic compound.
Electrical resistance was measured, showing a decrease followed by an increase in resistance. This trend is linked to a reduction in defects and the achievement of direct Ni-Al bonds, which initially reduce electrical resistance. However, an increase in the IMC layer's thickness over time led to increased electrical resistance. These findings offer insights and useful information for optimizing the Ni surface-Al bonding process in metallurgical and battery encapsulation applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Aluminum, Copper / Nickel / Cobalt, Joining |