| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
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| Presentation Title |
Joint Properties of Ni-less Surface Finish / Sn-Alloy Solder Using Laser-Assisted Bonding (LAB) Technique |
| Author(s) |
Seonghui Han, Sang-Eun Han, Tae-Young Lee, Young-Bae Park, Sehoon Yoo |
| On-Site Speaker (Planned) |
Sehoon Yoo |
| Abstract Scope |
This study investigated the characteristics of Ni-less surface finish/Sn alloy solder joints bonded by the Laser-Assisted Bonding (LAB) technique. LAB is a technology that spreads a laser beam to selectively irradiate the bonding area. This reduces warpage and enables fine pitch semiconductor package interconnects. Additionally, the Ni-less surface finish used in this study is suitable for fine pitch because it eliminates the thick Ni layer. In this study, Direct Electroless Gold (DEG) and Direct Palladium Immersion Gold (DPIG) were used as Ni-less surface finishes. The intermetallic compound (IMC) thickness was lower for LAB compared to mass reflow (MR). As the laser power increased, the size of the β-Sn phase increased, and the area fraction of the eutectic network increased. Additionally, as the laser power increased, the brittle failure rate also increased. Mechanical properties and microstructure changes depending on LAB conditions and bonding techniques will also be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, |