| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Exploring Low-Temperature Soldering with Good Soldering Strength: Investigating Soldering Behavior |
| Author(s) |
Yu-An Shen |
| On-Site Speaker (Planned) |
Yu-An Shen |
| Abstract Scope |
Electronic packaging is crucial for the semiconductor industrial evolution. Low-temperature soldering can reduce thermal warpage and energy consumption during the packaging process. Besides, reducing the soldering temperature would benefit the industry significantly for applications involving materials sensitive to thermal shock. Recently, eutectic Sn-In alloys, with a melting point around 120°C, have been used to lower soldering temperatures to 150-160°C. However, the low strength of eutectic SnIn alloys poses a reliability issue for joints. This study proposes a novel soldering method that reduces the soldering temperature to below 100°C while achieving a soldering strength exceeding 30 MPa, a significant improvement over eutectic SnIn alloys. The results will present the joining microstructure, mechanical and thermal properties, and phase diagram calculations. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Solidification |