About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
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Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
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Presentation Title |
Solid/Solid Interfacial Reactions between Lead-free Solders and Cu-Ni-Si-Mg (C7025) Substrate |
Author(s) |
Ting Chen, Jing-Ting Chou, Yee-Wen Yen |
On-Site Speaker (Planned) |
Ting Chen |
Abstract Scope |
The solid/solid reaction couple technique was employed to investigate the interfacial reactions between the Cu-3.0 wt.% Ni-0.65 wt.% Si-0.15 wt.% Mg (C7025) substrate and lead-free solders (LFS)-Sn, and Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) at 125, 150, and 175°C for 96 to 1536 h. The η'-Cu6Sn5 phase near the solder and the (Cu, Ni)6Sn5 phase close to C7025 substrate were formed in all couples. No Cu3Sn phase was found at the LFS/C7025 interface. The thickness of the intermetallic compounds (IMCs) increased with the increase in the reaction times and temperatures. However, the thicker IMC layer was observed in the SAC/C7025 couple. The cracks observed at the LFS/C7025 interface due to the mismatch in the coefficient of thermal expansion between the (Cu, Ni)6Sn5 phase and C7025 substrate. Meanwhile, the cracks were observed among the η'-Cu6Sn5 phases attributed to the stress from the IMC growth. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Phase Transformations, Other |