| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Effect of Copper Grain Size on Interfacial Reactions of Copper/Solder/Copper sandwiched joints |
| Author(s) |
Man-Hsuan Chung, Chih-Ming Chen |
| On-Site Speaker (Planned) |
Man-Hsuan Chung |
| Abstract Scope |
With the advancement of electronic packaging technology, the soldering reaction may occur in an environment with a temperature gradient. Therefore, the soldering reaction may be influenced by the thermomigration effect. Furthermore, the solder joints become smaller with the minimization of electronic devices, aggravating the impact of thermomigration. Electroplating is a cost-effective method to fabricate the Cu substrate and also enables the manipulation of the grain size. In this work, the interfacial reactions in the Cu/Sn-based solder/Cu sandwiched joints under thermomigration are investigated. The Cu substrates at the two ends of the sandwiched joint are fabricated using electroplating and their grain sizes are controlled by formulating the plating solutions. The results show that asymmetric growth of Cu6Sn5 is observed at the two end interfaces of the joint under thermomigration. However, the asymmetric growth phenomenon of Cu6Sn5 shows a strong dependence on the grain size of Cu. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Thin Films and Interfaces, Copper / Nickel / Cobalt |