About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Efficient Interfacial Sinter Bonding of Ag to Semiconductor Substrates via Current-Induced Electric Fields |
| Author(s) |
Tomoki Matsuda, Shinji Fukumoto |
| On-Site Speaker (Planned) |
Tomoki Matsuda |
| Abstract Scope |
A low-temperature sinter bonding using fine particles has been attracting attention as a promising technology for next-generation power devices. We have developed the direct sinter bonding process for both metals and non-metallic materials including semiconductors using the redox reaction inducing decomposition of metal precursors. The sintered interface can be formed by in-situ nucleation of metals derived from those precursors, indicating that the migration of ions temporary present during the bonding process contributes to the interfacial formation. In this study, we demonstrate the efficient interfacial formation for low-temperature sinter bonding of Ag to semiconductor substrates via current-induced electric fields. |
| Proceedings Inclusion? |
Planned: |