About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Thermomigration of Sn-Based Solder Joints with Multi-Element Alloy Diffusion Barriers |
| Author(s) |
Zhou-Yi Wu, Yi-Hsiang Chen, Po-Hsun Yang, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Zhou-Yi Wu |
| Abstract Scope |
As electronic devices advance toward miniaturization and multifunctionality, the reliability of solder joints in three-dimensional integrated circuit (3D IC) packaging becomes increasingly critical. In Sn-based solder systems, rapid interdiffusion with metal atoms leads to the formation of brittle intermetallic compounds (IMCs), degrading mechanical integrity and fatigue resistance. This challenge is exacerbated as micro-bump dimensions shrink, demanding more robust diffusion barriers. Conventional Ni-based barriers suffer from severe consumption and are vulnerable to electromigration- and thermomigration-induced failure. To address this, we propose a multi-element alloy thin film as a novel diffusion barrier. This study investigates the thermomigration behavior of Sn-based solder joints with the proposed barrier and compares the microstructural evolution and IMC suppression performance to those of conventional Ni barriers. Additionally, the failure mechanisms of the multi-element alloy under thermomigration conditions are examined in detail. The findings aim to provide insights into designing advanced barrier materials for reliable, miniaturized electronic packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
High-Entropy Alloys, Characterization, Copper / Nickel / Cobalt |