About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Ni-Ga and Cu-Ga Compounds Growth during Solid-Liquid and Solid-Solid Reactions |
| Author(s) |
Hsiang-Chun Chang, Yi-Wun Wang |
| On-Site Speaker (Planned) |
Hsiang-Chun Chang |
| Abstract Scope |
Sn2Ga solder was reacted with Ni and Cu substrates to evaluate its feasibility for electronic packaging. Intermetallic compounds (IMCs) growth was analyzed at various reaction times and compared with the Sn/Ni and Sn/Cu system. Preliminary results show time-dependent IMC behavior, and EPMA will be used to examine Ga distribution. Long-term solid-state aging tests with Sn2Ga/Ni and Sn2Ga/Cu joints are also investigated. The objective of this study is to establish growth kinetics of Ni-Ga and Cu-Ga compounds for joint interconnection. |
| Proceedings Inclusion? |
Planned: |