About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Study on Electrodeposited Sn/Bi Bilayers for Low-Temperature Soldering |
| Author(s) |
Chih-Hui Yu, Chih-Ming Chen |
| On-Site Speaker (Planned) |
Chih-Hui Yu |
| Abstract Scope |
Low-temperature soldering has attracted increasing attention due to its potential in energy saving and carbon reduction. Sn–Bi alloys are considered as promising joining materials in low-temperature lead-free soldering because of their proper melting point. Compositional control of Sn–Bi alloys during electrodeposition remains challenging due to the large difference in reduction potentials between Sn and Bi. In this study, Sn/Bi bilayer structures were fabricated using sequential electroplating. By adjusting the Sn/Bi thickness ratio and incorporating trace amounts of third element into the electroplated layer, the effects of these modifications on thermal property and microstructural change under various heat treatment conditions were investigated. |
| Proceedings Inclusion? |
Planned: |