About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
An Improved Bonding Interface in Ultrasonic Welding of Stainless Steel via Introduction of Dynamic Recrystallization Interlayers
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| Author(s) |
Dong-Yu Wu, Cheng-Chang Hsieh, Jhe-Yu Lin, Yun-Ta Chung, Hue-En Chu |
| On-Site Speaker (Planned) |
Dong-Yu Wu |
| Abstract Scope |
This study examines how interfacial deformability affects bond strength in ultrasonic welding of austenitic stainless steel. Specimens without interlayers showed limited strength improvement due to internal cracking from interfacial sliding below 0.6Tm. Introducing Fe and Ni interlayers significantly enhanced interfacial strength above 2500N with reduced welding time. Substantial hardness reduction below 0.4Tm facilitated extensive bonding. Dynamic recrystallization refined Fe interlayer grains through shorter weld durations, while Ni interlayers exhibited grain growth from higher temperatures. Both interlayers improved bonding integrity through plastic accommodation, with Fe interlayers increasing strength by 24% (2050N to 2500N) and reducing weld duration by 40%. The fracture location shifted from the weld edge to the substrate material. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Iron and Steel, Mechanical Properties |