About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
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| Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
Phase Transformation-Driven Interface Evolution and Bonding Mechanisms in Lamellar Ti/Ni/Ti Ultrasonic Welds
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| Author(s) |
Dong-Yu Wu, Cheng-Chang Hsieh, Jhe-Yu Lin, Tung-Ling Hsieh, Mao-Ting Liu |
| On-Site Speaker (Planned) |
Dong-Yu Wu |
| Abstract Scope |
This study explores the role of phase transformations in driving interface evolution and bonding behavior during ultrasonic welding (USW) of lamellar Ti/Ni/Ti structures. Commercially pure α-Ti plates were joined using nickel (Ni) interlayers to form a well-defined lamellar architecture. At a welding energy input of 1200 J, a fracture occurred within the titanium base metal, indicating the formation of a strong metallurgical bond. High-resolution microstructural analyses using SEM and STEM-EDS revealed the development of a continuous β-Ti interfacial layer, followed by the formation of nanoscale intermetallic compound (IMC) layers. These transformations were induced by solid-state reactions between α-Ti and Ni under ultrasonic energy. The sequential formation of IMCs—NiTi2, NiTi, and Ni3Ti from the Ti side toward the Ni side—was confirmed through STEM-EDS and NBED techniques, suggesting the reaction pathways governing interface formation in these dissimilar metal welds. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Phase Transformations, Mechanical Properties |