| Abstract Scope |
With the development of technology, wearable electronic devices have become increasingly prevalent, wherein solder materials play an important role. Concurrently, rising environmental concerns have accelerated the shift from conventional lead-bearing solders to environmentally friendly lead-free alternatives. Within this context, the reduction of process temperatures and the enhancement of lead-free solder properties have emerged as critical research challenges. Recent investigations have demonstrated that the incorporation of trace amounts of gallium (Ga) into solder alloys can effectively improve wettability, as well as enhance joint integrity and reliability. In the present study, a Sn–0.5Ga solder alloy was utilized to bond Cu substrates at 250 °C for durations from 2 to 80 min.The microstructure and composition of intermetallic compounds (IMCs) were conducted by using SEM and EPMA. Cu9Ga4 and Cu6Sn5 were observed at the interface.
Keywords: Lead-Free Solder , Process Temperature, Gallium, Microstructure, Cu9Ga4 |