| Abstract Scope |
In this study, we investigated the relationship between microstructural evolution and mechanical properties of Sn52In/ENEPIG joints. Smaples were conducted by solid-liquid and solid-state reactions. During solid-liquid reaction,Ni3(Sn,In)7 was formed between Sn52In and ENEPIG. Ni3(Sn,In)7 formed during 60-110oC aging. The mechanical properties of Ni3(Sn,In)7 was carried out by using nanoindenter. A hardness of 0.95±0.03 GPa and a Young's modulus of 38.3±3 GPa are obtained for Ni3(Sn,In)7. By employing the low-temperature soldering process in this experiment, the formation of the low-temperature phase Ni3(Sn,In)7 in the Sn52In/ENEPIG system was observed, enabling a better understanding of the growth behavior of this intermetallic compound and its mechanical properties.
Keywords: Sn52In, ENEPIG, Ni3(Sn,In)7, nanoindenter |