About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Effect of Bi contents on mechanical properties of Sn-Bi-Zn-In alloy |
| Author(s) |
Hiroki NAKAWAKI, Hiroaki Tatsumi, Chih-han YANG, Shih-kang LIN, Hiroshi Nishikawa |
| On-Site Speaker (Planned) |
Hiroshi Nishikawa |
| Abstract Scope |
Thermal warpage has become a serious issue for three-dimensional integrated circuit packaging and step soldering assembly. Therefore, eutectic Sn-58Bi alloy has drawn much attention as a potential lead-free solder in the industry due to its superior mechanical properties and low-melting-temperature of 139 °C. However, Bi-rich phase causes the degradation of its mechanical properties because of the intrinsic brittleness of Bi. In this study, the effects of Bi content on the mechanical properties of Sn-Bi-Zn-In were investigated. At low strain rates, moderate Bi content, ductility improves due to strain dispersion by the fine Bi-rich phase. With high Bi content, the ductility deteriorates due to the lack of strain dispersion, and with too low Bi content, the ductility is impaired due to the brittle Sn-rich phase dominating ductility. At high strain rates, the Bi-rich phase does not elongate and remains as a coarse Bi-rich phase. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, |