About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
Ultrasonic Welding of Ni-Plated CoFeMnNi High-Entropy Alloy: Bonding Behavior of CoFeMnNi/Ni/CoFeMnNi Interface and Mechanical Performance Analysis |
| Author(s) |
Yan-Lin Zhu, Jhong-Ren Huang, Yu-An Shen, Jhe-Yu Lin |
| On-Site Speaker (Planned) |
Yan-Lin Zhu |
| Abstract Scope |
This study investigated the interface behavior and mechanical properties of ultrasonically welded (USW) CoFeMnNi/Ni/CoFeMnNi high-entropy alloy (HEA) joints for diffusion barrier structures. Lap shear testing revealed that welding parameters (3000N/2.5s) achieved a maximum fracture load of 1655 N, reaching 95% of the base metal fracture load (1749 N). The welded joints demonstrated excellent ductility, with tensile displacement reaching approximately 4 mm, indicating good bonding achievement. The study reveals a correlation between welding time and joint strength, with strength increasing from 350 N at 0.5 s to 1655 N at 2.5 s. These results demonstrate the feasibility of producing dissimilar interfaces between HEA barrier layers and Ni through USW. Future work will focus on analyzing the correlation between electrical properties and phase identification at the dissimilar HEA/Ni interface. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Mechanical Properties, High-Entropy Alloys |