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Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
Presentation Title
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Proceedings Inclusion? Planned:
Keywords Biomaterials, Phase Transformations, Surface Modification and Coatings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Advanced Characterization and Analysis for Improved Stable Material Structures
B-36: Liquidus Projection and Invariant Reactions of Bi-Cu-Sn System
B-37: Orientation Effects on the Electrically Induced Phase Transformation in Zirconia
B-38: Phase Equilibria, Solidification and Properties of Al-Cu-Ni-Sn Alloys
B-39: Simulation of Polycrystalline Microstructure Formation in Thin Film for Nanoscale Device Using Phase-Field Method
B-40: Sn-Zn-Bi Low-Melting Alloy with Great Aging Resistance and Wettability
Bonding Mechanism for Cu/SiO2 Hybrid Joints
Computational Simulation of Interfacial Bonding Behavior with Various Grain Structures in Cu-Cu Bonding
Effect of Copper Grain Size on Interfacial Reactions of Copper/Solder/Copper Sandwiched Joints
Effect of Interfacial Microstructure on Mechanical and Electrical Properties in Ultrasonically-Welded Ni/Al/Ni Lamellar Structure
Electrochemical Evaluation of Plating Parameters in Anomalous Codeposition Behavior of Invar Electroplating
Electrodeposited Gallium for Cu-to-Cu Interconnection
Exploring Low-Temperature Soldering with Good Soldering Strength: Investigating Soldering Behavior
Exploring Solder Wetting Angle by Using Machine Learning Approach
Fabrication and Properties of Nanotwinned Copper Doped with Carbon Nanotubes by Electrodeposition
Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly
Growth of Cu6Sn5 in a Cu/Sn/Cu Micro-Joint with a TFMG/Cu Dual Diffusion Barrier Layer During Thermocompression Bonding
High-Strength and High-Conductivity Nanotwinned Copper Foils Via Cu-Ni Co-Electrodeposition
In-situ Characterization of Electrical Current Induced Structural Changes in Single-Phase η-Cu6Sn5 Using Synchrotron Radiation
Interfacial Reactions Between Sn-Based Solders and FeCoNiCrMn High-Entropy Alloy
Interfacial Reactions between Sn and Ru for EUV Photolithography Applications
Joint Properties of Ni-Less Surface Finish / Sn-Alloy Solder Using Laser-Assisted Bonding (LAB) Technique
Li and Na Interaction in Intercalation Materials
Liquid-Solid Interfacial Reactions Between Lead-Free Solders and Cu-6.01wt.% Sn-0.12wt.%P Alloy (C5191)
Liquidus and Invariant Reaction Temperatures of Sn-In-Ni-Zn Alloys
Liquidus Projections and iInvariant Reactions in the Bi-Cu-Sn-Te Quaternary System
Liquid/Solid Interfacial Reactions Between the Sn Solder and Cu-Fe Alloy (C194) with the Ni Plating Layer
Microstructural Analysis and Mechanical Properties Evaluation of Zinc-Coated Aluminum Particles
Microstructure Evolution and Growth Behavior of Intermetallic Compound Between Cu and Sn-Ag Alloys
Microstructure Evolution and Phase Transformation of Ni-Sn Compounds aAfter Long-Term Storage
Solid/Solid Interfacial Reactions Between Lead-Free Solders and Cu-Ni-Si-Mg (C7025) Substrate
Striped Strain-Induced Coherency Loss Leading to Metastable Nanoprecipitate Phase Transformation in Al-Zn-Mg Alloys
Synergistic Inhibition Effect of Nitrides and Metal Ions on Corrosion of Copper
The Effect of Temperature on the Microstructure, Lattice, Mechanical and Electrical Properties of Sn-Bi Alloys

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