About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
Effects of Au and In on Microstructural Evolution of Bi-based Solders |
| Author(s) |
Yi-Wun Wang, Jang-Cheng Fang, Tzu-Yi Lin, Xiang-Ting Lin, Kai-Lin Cheng |
| On-Site Speaker (Planned) |
Yi-Wun Wang |
| Abstract Scope |
With the advancement of electronic products, multifunctional designs can meet consumer demands. Moreover, in response to net zero emissions, it is essential to reduce bonding temperatures. Low-temperature solders offer an effective solution to lower bonding temperatures. In this study, lead-free BiIn and SnBi solders were selected to investigate interfacial reactions with Cu substrates, under both solid-liquid and solid-solid reactions. This study investigates the evolution of microstructures and mechanical properties after reflow and long-term storage. It further examines the influence of In content and Au additions on interfacial reactions in low-temperature solders. By leveraging their low-melting points, these alloys aim to reduce processing temperatures and, consequently, carbon emissions. Experimental results indicate that insufficient In content in Bi-based solders hinders wetting at the joint, while minor Au can significantly enhance the mechanical properties at the interface.
Keywords: Net Zero Emissions, Low-Temperature Solders, BiIn, SnBi, Mechanical Properties |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, |