About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Structure Analysis of Sn-Containing Intermetallic Phases |
| Author(s) |
Andreas Leineweber |
| On-Site Speaker (Planned) |
Andreas Leineweber |
| Abstract Scope |
The use of low-melting metals (e.g., Sn-based alloys) for metal joining is of great importance for electronic packaging. It is the microstructure of the technological joints which determine the mechanical and electrical performance. Therefore, microstructure characterization is a crucial part of improving existing or generating new joining processes. However, in many cases information on the phase equilibria and crystal structures of the developing intermetallic phases is incomplete or poorly understood. This frequently obstructs proper analysis and interpretation of developing microstructures.
The presenters’ group has been active in the recent years to study “soldering relevant” alloy systems mainly making use of model alloys and diffusion couples. Usually X-ray diffraction and scanning electron microscopy including electron backscatter diffraction have been applied complementarily. Studies of systems such as Ni-Sn and Cu-Sn established new constitutional information, as well as information on the crystal structures and defects that are helpful for tailoring phase identification. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Phase Transformations, Copper / Nickel / Cobalt |