About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Development of Low-Temperature Sn-Bi Alloys Using Sequential Electrodeposition |
| Author(s) |
Chih-Hui Yu, Chih-Ming Chen |
| On-Site Speaker (Planned) |
Chih-Hui Yu |
| Abstract Scope |
Sn–Bi alloys have emerged as promising candidates for low-temperature lead-free soldering applications owing to their low melting point and cost-effectiveness. However, electrodepositing Sn–Bi alloys poses challenges about the difficulty in the compositional control. In this work, vertically stacked structures of Sn/Bi bilayers were fabricated using electroplating. The composition of the resulting Sn–Bi alloy can be adjusted from eutectic to hypoeutectic by changing the Sn/Bi thickness ratio to study the thermal behavior and microstructural evolution upon heat treatment. A trace amount of Ag was also introduced in the Sn layer to investigate its influence on the microstructural evolution of the Sn-Bi alloy. Furthermore, the original vertical bilayer configuration was modified to a horizontal structure, forming a Sn–Bi diffusion couple and increasing the interfacial diffusion distance to facilitate more precise diffusion analysis. |
| Proceedings Inclusion? |
Planned: |