About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
The Interfacial Properties of Indium Thermal Interface Materials |
| Author(s) |
Po-hsiang Juan, Kuan-chen Kung, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shih-kang Lin |
| Abstract Scope |
Thermal interface materials (TIMs) play a critical role in thermal management, as their properties significantly affect the overall heat dissipation of the electronic packaging systems. By filling microscopic gaps between contacting surfaces, TIMs displace air gaps and enhance the actual contact area. This improvement in interfacial contact allows heat to transfer more efficiently from the heat-generating component (such as a chip) to the heat-dissipating structure (such as a lid or heatsink), thereby lowering interfacial thermal resistance and significantly enhancing heat dissipation performance. In this study, indium is selected as TIM. We first investigate the interfacial reaction between indium and backside metallization layer under various conditions. Subsequently, we measure the thermal resistance of die/In/die sandwich structure. By correlating the interfacial reaction with the measured thermal resistance, we aim to identify the key factors influencing thermal performance. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Thin Films and Interfaces |