About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
Interfacial Reactions of Sn-3.0Ag-0.5Cu (SAC) Solder With the Ni-xPd Alloys |
| Author(s) |
Yu-En Huang, Yi-Shan Li, Hsien-Ming Hsiao, Mao-Wei Chen, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Yu-En Huang |
| Abstract Scope |
The interfacial reactions between Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC) solder and Ni-xPd (x = 0, 0.5, 1.5, and 3.0 wt.%) substrates were investigated at 240, 270, 300 and 330°C for reaction times of 10 min to 5 h. The experimental results revealed that both the (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 phases formed at the SAC/Ni-xPd interface. However, when the reaction temperature was greater than 240°C, the (Cu,Ni)6Sn5 phase was observed only at shorter reaction times (10 min), whereas the (Ni,Cu)3Sn4 phase became dominant with longer reaction times. The addition of Pd effectively suppressed the growth of the (Ni,Cu)3Sn4 phase, leading to reduced intermetallic compound (IMC) thicknesses and enhanced interfacial stability. Kinetic analysis indicated that the IMC growth mechanism was diffusion-controlled. Mechanical testing revealed that joints with Ni-xPd substrates exhibited improved tensile strength compared to those with pure Ni, highlighting the beneficial effect of Pd addition on joint reliability. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, |