About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Investigation of Ga Addition on the Microstructural Evolution Between BiIn and Cu |
| Author(s) |
Erh-Chin Hsieh, Yi-Wun Wang |
| On-Site Speaker (Planned) |
Erh-Chin Hsieh |
| Abstract Scope |
The experiment was conducted by using Bi46In2Ga solder to a Cu substrate at 110 °C for 2 min in a solid-liquid reaction, followed by long-term isothermal aging under solid-state conditions. Systematically analyze the interfacial reaction behavior and intermetallic compound growth mechanisms. Low-temperature soldering processes can effectively reduce the risk of substrate warpage and thermal damage to components, thereby enhancing interfacial reliability. Low-temperature solders become a critical research focus in the field of electronic packaging.
The results show that CuGa2 formed at the interface after solid-liquid and aging reactions. No Cu-In intermetallic compounds formation at the interface.
Keywords: Bi46In2Ga, Low-Temperature Soldering, Thermal Damage, Electronic Packaging |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, |