About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Structural Evolution of Cu6Sn5 Strip Samples Under Electric Current Stressing |
| Author(s) |
Shubhayan Mukherjee, Yu-chen Liu, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shubhayan Mukherjee |
| Abstract Scope |
Cu6Sn5 intermetallics are commonly found in microelectronic joints, yet their response to high-density current flow has not been evaluated extensively in the context of electromigration-driven instability. In this study, we employ strip-shaped Cu6Sn5 samples to examine electric current-induced structural evolution under conditions analogous to Blech’s electromigration experiments. The strip geometry allows for directional electric current flow and well-defined stress gradients. Synchrotron-based X-ray nanodiffraction and high-resolution XRD are used to assess structural distortion, grain response, and phase evolution along the current axis. This work represents the first systematic effort to extend the electromigration framework to a bulk Cu–Sn intermetallic, providing insight into phase stability, stress buildup, and potential directional diffusion under electric current stressing. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Other, Other |