About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Fine-Grained Cu for Cu Hybrid Bonding in 3D IC Integration |
| Author(s) |
Chih Chen |
| On-Site Speaker (Planned) |
Chih Chen |
| Abstract Scope |
In the continuous miniaturization era of heterogeneous integration, the dimensions of copper joints have been pushed to their physical limits, with the grain size of electroplated Cu bumps scaling accordingly. As the feature size approaches the submicron regime, the Cu grain size can decrease below 200 nanometers, entering the fine-grained domain. It is therefore essential to evaluate the bonding quality of fine-grained Cu. Fine-grained Cu plays a critical role in Cu–Cu bonding due to its high density of grain boundaries, which not only serve as fast diffusion paths for atomic migration during bonding but also store internal energy that drives grain growth during post-annealing. Moreover, the fine-grained structure enhances thermal expansion in Cu vias during bonding. This presentation will discuss the fabrication and characterization of fine-grained Cu, examine its thermal stability, and reveal the grain growth behavior across the bonding interface after thermo-compression bonding. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Thin Films and Interfaces |