About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Development of a Transient Liquid Phase Soldering Process by Controlling Intermetallic Growth and Phase Transformations: Overview |
| Author(s) |
Kazuhiro Nogita, Nurul R. Abdul Razak, Xin Fu Tan, Keith Sweatman, Stuart D. McDonald |
| On-Site Speaker (Planned) |
Kazuhiro Nogita |
| Abstract Scope |
Transient liquid phase (TLP) soldering takes advantage of the isothermal reaction occurring between a liquid solder and substrate to form an intermetallic compound (IMC) with a melting point higher than the soldering temperature. This paper delivers an overview relating to TLP soldering to create joints suitable for high-temperature applications. The effect of Ni concentration in the Cu substrate on the growth mechanisms, morphology and spatial distribution of the (Cu,Ni)6Sn5 IMCs that develop during processing and the distribution of porosity that arises due to shrinkage or gas generated by the flux, will be discussed. Using a combination of state-of-the art in-situ and ex-situ techniques we investigate the effectiveness of these TLP soldering processes. Based on the results, several novel soldering methods are proposed to encourage non-uniform (Cu,Ni)6Sn5 IMC growth that has the potential to distribute any porosity in a controlled manner, resulting in improved joint properties. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Phase Transformations, Joining |