| Abstract Scope |
With the rise of flexible electronics, brittle Sn–Bi solders are inadequate while Sn–In alloys offer ductility but low hardness (<10 HV). Previous studies have explored doping Sn–In alloys with various third elements (e.g., Cu, Ag, Zn) to enhance mechanical performance, but the combined effects of multiple alloying additions remained unclear due to system complexity. We built a Vickers hardness database for Sn–In–X alloys (X = Cu, Ag, Zn, Bi, Sb, Al, Ni), trained a Gaussian Kernel Ridge Regression model, and coupled it with a genetic algorithm for inverse design. Candidate alloys were fabricated and tested. The optimized SIX alloy exhibited a threefold increase in hardness and more than double the tensile strength compared to eutectic Sn–52 wt.% In. This framework accelerates the development of advanced low-temperature solders for packaging and flexible electronics. |